RAM chips lower form factor via Wafer-Level Chip-Scale Packaging

Winbond Electronics Corporation announced the introduction of new HyperRAM products with WLCSP, which reaches an unprecedented thin form factor in embedded applications. HyperBus technology was first published by Cypress in 2014. Compared to the transmission and control interface of other memory, one of the characteristics of the HyperBus interface is the low pin count, which […] The post RAM chips lower form factor via Wafer-Level Chip-Scale Packaging appeared first on Electrical Engineering ...